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Jinbo Shi Associate researcher of Peking University
Innovation tutor of Beijing Collaborative Innovation Research Institute
Off-campus tutor of Xi 'an Jiaotong University
Research: Optical interconnection/High speed integrated circuit design for optical communication
Low power consumption and high integration of optical sensor chip design
Email: jingboshi@pku.edu.cn
Phone: 010-62765607
Personal Page:

https://ofcl.pku.edu.cn/info/1022/1138.htm

Jingbo Shi is a distinguished associate researcher at the School of Information Science and Technology, Peking University. He received his BACHELOR's degree in Electronic Science and Technology and master's degree in microelectronics and Solid State Electronics from School of Electronics and Engineering, Jilin University in 2005 and 2007 respectively, and his doctor's degree in Microelectronics and Solid State Electronics from School of Microelectronics, Fudan University in January 2018. The main research fields are high-speed integrated circuit design for optical interconnection/optical communication and optical sensor chip design with low power consumption and high integration. He has participated in and presided over a number of national, provincial and ministerial projects such as the Natural Science Foundation and the Shanghai Silicon-based Optoelectronics Major project, and has been granted one international patent.

Learning resume:

  • 2001.9-2005.7 Jilin University bachelor degree

  • 2005.9-2007.7 Master of Jilin University

  • 2013.9-2018.1 Doctor of Fudan University

Work experience:

  • November 2008 - April 2012 Tom Research Assistant of Communication Research Institute, Tohoku University, Japan, Engineer of Fujitsu Co., LTD

  • 2018.5-20119.10 Beijing Collaborative Innovation Research Institute Researcher independent PI

  • November, 2019-Present Associate Researcher, Peking University

Research projects:

  • Key subject of Beijing Science and Technology Plan, Z191100004819006, 100G silicon chip level optical interconnection technology research, under research, participated.

  • Independent project of Beijing Collaborative Innovation Research Institute, research and development of silicon based high-speed modulator driver chip for 100G optical interconnect, under research, in charge.

  • Military Commission equipment Development Department, pre-research project, XXXXXX silicon-based photoelectric XXXX, in the research, participate.